Wafer Grinding
SiC wafer etc. Hard material grinder.
Model GNX200BH is designed for processing hard materials in full-auto mode.
Material: SiC, GaN, Si , Glass , MEMS ,etc
Spindle: 2 Spindle
Chuck: 3 Chuck (Φ50,100,125,150,200mm)
Power: 6.7kW 8P
Machine has high-horsepower motor and extra rigid casting to compensate for maintaining tight tolerances.
For more information, Please contact us.
building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai,China.
302, 3rd Floor, Building B, Kaicheng High tech Park, Dalang Street, Longhua District, Shenzhen, China